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PEALD (Plasma-Enhanced Atomic Layer Deposition)

Specifications

1) Gases Flow Type

  : Lateral type

2) Available Film

  : Metal oxide thin film based O2 plasma & H2O, Metal thin film base H2 plasma

3) Substrate Size & Temperature

  : 25 ~ 400 [℃] ± 1 [%] On The Substrate of 150x150[mm²]

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PLD (Pulsed Laser Deposition)

Specifications

1) Uniformity Zone of Substrate Heating

  :Ø15 mm

2) Substrate Temperature

  : 850°C ± 5°C in oxygen

3) Operating Pressure

  : 0.01 mTorr ~ 10 Torr

4) Target Carousel

  : one inch (25.4mm) diameter for four targets

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RF & DC Sputtering System

(KVS-2000)

PROCESS CHAMBER
-MATERIAL : SUS 304
-SIZE : Φ265 X 300(H)
-2.75" CF FLANGE FOR GAUGE & GAS & EXTRA PORT
-1.33" CF FLANGE FOR SHUTTER PORT 


VACUUM PUMPING UNIT
-TURBO PUMP & ROTARY VACUUM PUMP
SUBSTRATE UNIT
-MAX TEMPERATURE : UP TO 7
50℃
-SUBSTRATE HOLDER : 3.5" SUS


SPUTTERING GUN SOURCE
-MAGNET : Nd-Fe-B
-N TYPE POWER CONNECTOR
R.F POWER SUPPLY & DC POWER SUPPLY 

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Probe Station

Specifications

1) Temperature

  : ~ 850 °C

2) Cryostat

  : ~ 4 K

3) Fiber

  : 300 ~ 1400nm Waverlength

4) RF

  : ~ 67GHz

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AFM (Atomic Force Microscope)

  
Specifications

1) Position sensitive quadrant photo detector optimized for laser wavelength.

2) <25 fm/Hz½ noise floor (noise level: 0.02 nm), Modular, flexible design to include optional modes

3) 50 mm range, 250 nm resolution motorized Z Stage
76 mm range, 50 nm resolution motorized XY Stage

4) Contact, Dynamic, EFM, PFM, CAFM, KFM modes

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PECVD (Plasma-Enhanced CVD)

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Mist-CVD (Chemical Vapor Deposition)

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Semiconductor Analyzer (keithley 2635b)

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Electrical Anodize System

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Water Splitting Device

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Lock-in Amplifier

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Centrifugal Separator

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Furnace

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